Technical Center

Technical Introduction

Vacuum coating technology

The so-called vacuum coating is a process in which a plating material and a substrate to be plated are placed in a vacuum chamber, and a material to be plated is heated by a certain method to evaporate or sublimate, and is sprayed and sputtered onto the surface of the substrate to be agglomerated to form a film.
According to the purpose: functional coating (conductive film, liquid crystal film, film capacitor and cutting tool coating), decorative coating (bathroom, hardware, various product shells) and packaging coating (packaging materials)
Vacuum coating technology is a thin film meteorological deposition technique that deposits reactants or targets onto a substrate by chemical or physical means in a vacuum environment.

Magnetron Sputtering

Magnetron Sputtering is a Plasma Vapor Deposition (PVD) process in which a plasma is created and positively charged ions from the plasma are accelerated by an electrical field superimposed on the negatively charged electrode or "target". The positive ions are accelerated by potentials ranging from a few hundred to a few thousand electron volts and strike the negative electrode with sufficient force to dislodge and eject atoms from the target. These atoms will be ejected in a typical line-of-sight cosine distribution from the face of the target and will condense on surfaces that are placed in proximity to the magnetron sputtering cathode.

Using a closed magnetic field to trap electrons, enhancing both the efficiency of the initial ionization process and allowing a plasma to be generated at lower pressures which reduces both background gas incorporation in the growing film and energy loses in the sputtered atom through gas collisions.